Technologies

A key innovation of this research project is the development of GaN power devices and integrated circuits that overcome the main limitations of today’s solutions, namely blocking voltage beyond 1.2 kV, high isolation capability, and thermal management. The project targets GaN power ICs rated at 1.7 kV and 10 A, implemented on insulating substrates such as SiC or sapphire to achieve more than 10 kV vertical isolation. This platform also enables an integrated isolated gate driver based on a patent-pending concept, while supporting direct mounting on a heatsink for improved thermal extraction. In addition, the technology is designed to facilitate the parallel operation of GaN devices, enabling higher current capability and scalable power conversion systems. 

Medium-voltage planar transformers overcome the limitations of conventional planar magnetic technologies

Another key innovation of the project is the development of medium-voltage planar transformers that overcome the major limitations of state of the art medium frequency transformers, typically restricted to low-voltage applications and with limited power density.

A modular PCB design enables 6 kV insulation and high power densities

The proposed technology targets a medium-voltage insulation rating of 6 kV and to reach power densities exceeding 10 kW/L through an optimized, modular, and scalable PCB design.

An advanced cooling solution supports high-power operation

This approach is intended to reduce manufacturing costs and shorten time to market while enabling practical use in higher-power systems. An advanced cooling solution for high-power operation is based on a patent-pending concept.

TPC and AND simplify communication and configuration of power converters

Another innovation of the project is Talkative Power Conversion (TPC) and Automatic Network Discovery (AND), which are designed to overcome current limitations in interoperability and upgradeability of power electronic systems.

Communication is directly integrated into the GaN-based power electronics

The concept introduces a communication link integrated into the power line without additional hardware, made possible by the fast switching characteristics of GaN.

Automatic Network Discovery automatically detects the system configuration

This integrated communication capability enables automatic network detection, including the detection of modules connected in series or in parallel. This allows the system to automatically determine its configuration without manual intervention.

Automatic configuration reduces commissioning effort and increases flexibility

This eliminates the need to configure each module individually. This simplifies commissioning, reduces risk of manual errors, increases flexibility, and supports scalable converter architectures.

An isolated power converter integrates advanced technologies into a compact PEBB

A final key innovation of the integration of the developed technologies into an isolated power converter, which has been implemented as a “Power Electronic Building Block” (PEBB). It is intended to overcome the current limitation that GaN devices and planar transformers are still primarily used in low-voltage applications, while the parallel operation of GaN devices and the interaction between multiple PEBBs remain complex.

The DC/DC converter integrates GaN and planar transformers into a single functional building block

The project’s goal is to develop a DC/DC converter for an integrated power module that combines these advanced technologies into a compact and functional building block.

A plug-and-play PEBB simplifies system integration and reduces configuration effort

The primary goal is to develop the first plug-and-play PEBB, which simplifies system integration, reduces configuration effort, and enables more modular, interoperable, and scalable power conversion architectures.